CBCP68 TR

CBCP68 NPN CBCP69 PNP SURFACE MOUNT SILICON COMPLEMENTARY SMALL SIGNAL TRANSISTORS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CBCP68 and CBCP69 are complementary silicon transistors manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for applications requiring high current capability. MARKING: FULL PART NUMBER SOT-223 CASE MAXIMUM RATINGS: (TA=25°C) Collector-Emitter Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Collector Current Continuous Base Current Peak Base Current Power Dissipation Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL SYMBOL ICBO ICBO IEBO BVCBO BVCEO BVEBO VCE(SAT) VBE(ON) VBE(ON) hFE hFE hFE fT Cob SYMBOL VCES VCEO VEBO IC ICM IB IBM PD TJ, Tstg ΘJA 25 20 5.0 1.0 2.0 100 200 2.0 -65 to +150 62.5 CHARACTERISTICS: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP VCB=25V VCB=25V, TA=150°C VEB=5.0V IC=10µA 25 IC=10mA 20 IE=1.0µA 5.0 IC=1.0A, IB=100mA VCE=10V, IC=5.0mA 0.6 VCE=1.0V, IC=1.0A 50 VCE=10V, IC=5.0mA VCE=1.0V, IC=500mA 85 VCE=1.0V, IC=1.0A 60 VCE=5.0V, IC=10mA, f=20MHz 65 VCB=5.0V, IE=0, f=450kHz 25 MAX 10 1.0 10 0.5 1.0 UNITS V V V A A mA mA W °C °C/W UNITS µA mA µA V V V V V V 375 MHz pF R7 (30-April 2019) CBCP68 NPN CBCP69 PNP SURFACE MOUNT SILICON COMPLEMENTARY SMALL SIGNAL TRANSISTORS SOT-223 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Base 2) Colllector 3) Emitter 4) Collector MARKING: FULL PART NUMBER SYMBOL A B C D E F G H I J K L M DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0° 10° 0° 10° 0.059 0.071 1.50 1.80 0.018 --0.45 --0.000 0.004 0.00 0.10 10° 10° 0.009 0.014 0.23 0.35 0.248 0.270 6.30 6.85 0.114 0.122 2.90 3.10 0.130 0.146 3.30 3.70 0.264 0.287 6.70 7.30 0.024 0.033 0.60 0.85 0.091 2.30 0.181 4.60 SOT-223 (REV: R5) R7 (30-April 2019) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)